| |
|
|
1998 |
| |
|
1st Qualification Sample
submitted |
| |
|
1999 |
| |
|
Commercial Production
Started |
| |
|
Chief Executive Mr. Tung
Chee Hwa visited site |
| |
|
ISO 9002 Certified |
| |
|
2000 |
| |
|
Top Ten Business Maker
Award |
| |
|
Asia-Pacific Economic
Co-operation Secretariat Visit |
| |
|
2ML product introduced
to customers |
| |
|
Ministry of Foreign Trade
& Economic Cooperation |
| |
|
The People’s Republic
of China's Visit |
| |
|
2ML commercial production
started |
| |
|
Bumped Flip Chip Flex
introduced |
| |
|
HKSAR Commerce and Industry
Bureau delegation visit |
| |
|
"Enlightened Employers
Award” from Labor Department |
| |
|
Certificate of Merit from
HK Productivity Council awarded |
| |
|
ISO 14001 Certified |
| |
|
2001 |
| |
|
ITF Program for Embedded
Passives on Tape Substrates |
| |
|
Former Vice Mayor of Shanghai,
Mr. Liu visits site |
| |
|
2002 |
| |
|
Deloitte Touche Tohmatsu
Fast 500 award |
| |
|
2003 |
| |
|
38 micron pitch COF introduced
|
| |
|
2ML COF products introduced
to Intel |
| |
|
Kunshan Vice Mayor delegation
visit |
| |
|
Hong Kong Awards for Industry
- Quality Grand Award |
| |
|
2004 |
| |
|
Production of Camera Module
Flex for Mobile Phones |
