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| Vision Statement | 1 Metal layer/ 2 Metal Layer Tape Ball Grid Array (1 ML/ 2ML TBGA) | |||
| Quality Policy | Micro Ball Grid Array (uBGA) | |||
| Environment Awareness | Chip On Flex (COF) | |||
| Human Resources | Chip Scale Package (CSP) | |||
| Request Information | Flexible Printed Circuit (FPC) | |||
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