Major Events
2004
Production of
Flexible Printed Circuit
for Camera Module of Mobile Phones
June 2003
Kunshan Vice Mayor delegation visit
June 2003
2ML COF products introduced.
March 2003
38 micron pitch COF introduced
August 2001
Former Vice Mayor of Shanghai, Mr. Liu visits.
April 2001
ITF Program for Embedded Passives on Tape Substrates
March 2001
Facility renovation of China Inspection Center completed
November 2000
HKSAR Commerce and Industry Bureau delegation visits
October 2000
Bumped Flip Chip Flex introduced
September 2000
2ML commercial production started
July 2000
Ministry of Foreign Trade & Economic Cooperation, The People’s Republic of China's Visit
June 2000
2ML product introduced to customers
May 2000
Asia-Pacific Economic Co-operation Secretariat visits
May 1999
Chief Executive Mr. Tung Chee Hwa visited site
January 1999
Commercial Production Started
"
We bring
FLEX
-
ibility to life
."
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