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1 ML/2 ML TBGA One Metal Layer/
Two Metal Layer |
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| BGA (Ball Grid Array) package is a method of reducing package size and pin-to-pin trace gap. This results in the integration of more functions and reliability in a single space. BGA typically uses a polymide-based organic substrate for die and wire attachment. This substrate incorporates metallized trace routing for connection of the die to the system board through solder balls, instead of metal leads used in leaded packages. | |||
| TBGA is extremely useful for high-speed devices because of the shrinkage of wiring length due to its superior wiring density of flex circuitry.With capability rapidly approaching 20-um lines and spaces, a ball-array pattern that would require two, or even four layers of circuit board to route can now be implemented on a single layer of flexible substrate. | |||
| Two-metal layer TBGA having signal/power layer and ground plane layer on each side of the dielectric film, which can achieve superior electrical properties, is strongly recommended for high performance TBGA package. | |||
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