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COF
Chip On Flex
COF circuit modules offer a cost-effective way to combine IC driver attachment and panel connection.Ideal for applications that requires the circuit to be bent or shaped to accomplish the assembly of the device.
Applications :
Optical Components, Camera, LCD Modules Cell Phones, Medical Instruments and Devices, Digital Wrist Cameras.
 

Chip-on-flex (COF) packaging provides an attractive alternative to reduce the packaging interconnect required in many applications. COF has high bending strength, thus is very useful for applications where the bending of the circuit is required in the assembly of a device. The film is fully flexible except the area where the component is mounted. In addition, COF packaging is widely used in display products.

 

COF enables the design and production of lighter, faster and smaller electronic products since flexible circuits offer the advantages of being thinner and lighter than rigid PCBs. COF can lower the production cost of complicated electronic products. The flexibility of COF enables the folding of circuits, which can reduce the size of the COF module.
 
The flexibility of COF is a competitive advantage over similar technologies, such as chip-on-board (COB) and chip-on-glass (COG), in which rigid supporting material are needed.
" We bring FLEX-ibility to life."
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