Provides near die size assembly while enabling simple die test and burn-in screening. Compatible with standard surface mount assembly lines.

Chip Scale Packaging (CSP) is the combination of the best of flip chip assembly and surface mount technology. It gives almost the size and performance benefits as bare die chip assembly, while simultaneously offering the advantages of an encapsulated package. CSPs can be standardised, tested, surface mounted and reworked.

By using CSP, the interposer design for the die can be modified to accommodate a smaller die without altering the footprint of the package. Also, it provides near die size assembly while enabling simple die test and burn-in screening. It is compatible with standard surface-mount assembly lines.